Tensor-I22
specifications
CPU
4 Core, 8 Threads | Base: 1.8/2.8 GHz, Boost: 4.4 GHz | 12 MB Cache | TDP: 15/28 W1 | vPro
4 Core, 8 Threads | Base: 1.5/2.6 GHz, Boost: 4.1 GHz | 8 MB Cache | TDP: 15/28 W1 | vPro
2 Cores, 2 Threads | Base: 1.8 GHz | 4 MB Cache | TDP 15 W
CPU frequency is preset to match cooling capacity and target case temperature.
Owner can adjust this setting in BIOS.
1 For 28W CPU operation, EW30-ECR20 housing is recommended (300 X 200 X 45.3 mm)
RAM
Up to 64 GB
2x SODIMM DDR4 up to 3200MT/S
Storage
| Storage devices: |
| Basic configuration: |
| Optional TEL-NVME on TRIP1 |
| Optional TEL-NVME on TRIP2 |
| Optional TEL-SATA1 1 |
| Up to 3 NVMe/ SATA storage devices |
| NVMe or SATA on M.2 (PCIe x4 Gen. 4 or SATA 3) |
| Additional NVMe on M.2 (PCIe x4 Gen. 3) |
| Additional SATA on M.2 |
| Additional SATA on 2.5” for SSD/HDD |
1 Some expansion TELs require a larger housing
Display
| Graphics: |
| Display outputs: |
| HDMI |
| Mini-Display Port |
| Integrated Intel® Iris® Xe Graphics |
| Up to four independent displays |
| 2x HDMI 1.4b (up to 3840 x 2160 @ 30Hz) |
| 2x DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode |
Networking
| Ethernet ports |
| Basic configuration |
| Optional TEL-LANX2 |
| Optional TEL-OPLNX2 |
| Optional TEL-POEX2 1 |
| Up to 4 ports |
| 2x Gigabit Ethernet on RJ45 |
| Additional 2x Gigabit Ethernet on RJ45 |
| Additional 2x SFP+ ports for optical LAN |
| Additional 2x GbE LAN on RJ45 with PoE source of up to 15W each |
1 Some expansion TELs require a larger housing
| Wireless Connectivity |
| M.2 Key-E 1 |
| M.2 Key-B 1 |
| Optional TEL-PCIEmini |
| For M.2 2230 module with Wi-Fi 6E, BT 5.2 |
| For M.2 LTE/5G |
| For mini PCIe module, w/ micro-SIM tray |
1 Additional options are available with extension TELs
I/O
| USB ports |
| Basic configuration |
| Optional TEL-USB3PCIV4 |
| Optional TEL- USB2V4 |
| Up to 12 USB 3.1 / 2.0 ports |
| 4x USB Type-A: 2x USB 3.1 + 2x USB 2.0 |
| Up to 2 additional 4x USB 3.1 on USB Type-A |
| Up to 2 additional 4x USB 2.0 on USB Type-A |
| Audio |
| Codec |
| Interfaces |
| Optional analog audio on TEL-AUDIO |
| Optional analog output, analog input on 3.5 mm jacks |
| Serial/GPIO |
| Serial/GPIO ports 1 |
| RS-232 / RS-485 1 |
| CAN bus |
| GPIO |
| Up to 20 RS-232 / RS-485 or 40+ isolated GPIOs |
| Up to 20 RS-232 / RS-485 ports on DB9 |
| Up to 9 isolated CAN bus ports on DB9 |
| Up to 5 modules with 20 isolated GPIOs each, on terminal blocks |
1 Some expansion TELs require a larger housing
Extensions
| TEL |
| FT.C-LAN2 |
| FT.EC-USB2V4 |
| FT.ED-USB3PCIV4 |
| FT.F-M2NVME for NVMe |
| FT.F-M2NVME for SATA |
| FT.F-M2NVME for AI |
| FT.H-SER4 |
| FT.HB-DB9 |
| FT.HA-SER1 |
| FT.I-M2B |
| FT.J-M2E |
| FT.L-PCIEmini |
| FT.Q-CAN |
| FT.S-GPIO |
| FT.V-TERM4 |
| FT.T-SATA1 2 |
| FT.U-POE2 |
| FT.W-OPLN2 |
| Description | Max. quantity | Where connected | PN |
| Additional 2x Gbit LAN 1 | 1 | TRIP1 | FC |
| Additional 4x USB 2.0 1 | 2 | TRIP1 / TRIP2 | FEC |
| Additional 4x USB 3.0 1 | 2 | TRIP 1,2 | FED |
| Additional M.2 Key-M for NVMe 1 | 1 | TRIP1 | FFN |
| Additional M.2 Key-M for SATA 1 | 1 | TRIP2 | FFS |
| Additional M.2 Key-M for AI module 3 | 1 | TRIP2 | FFS |
| 1-4 isolated RS232 or RS4854 | 3 | TRIP1 / TRIP2 / int. USB | FH |
| DB9 connector for FT.H-SER4 | 3 per FT.H-SER4 | FT.H-SER4 | |
| 1 port RS2324 | 3 | TRIP1 / TRIP2 / int. USB | FHA |
| Additional M.2 Key-B for modem 1/4 | 2 | TRIP1 / TRIP2 | FI |
| Additional M.2 Key-E for Wi-Fi/BT 1/4 | 2 | TRIP1 / TRIP2 | FJ |
| Mini PCIe compartment 4 | 2 | TRIP1 / TRIP2 | FL |
| Isolated CAN bus port 4 | 9 | TRIP1 / TRIP2 / int. USB | FQ |
| 4 – 20 isolated GPIOs 4 | 3 | TRIP1 / TRIP2 / int. USB | FS |
| Terminal block 4x for FT.S-GPIO | 4 per FT.S-GPIO | FT.S-GPIO | FV |
| 2x Gbit Ethernet with PoE PSE 802.3at Type 1 by RJ45 | 1 | TRIP1 | FU |
| 2 x SFP+ socket for optical GbE | 1 | TRIP1 | FW |
Notes:
- 1 This interface is also available in some quantity on the motherboard, without a TEL expansion module.
- 2 FT.T-SATA1 requires larger hosing: EH35C or EW30
- 3 FT.F-M2NVME for AI includes enhanced heat dissipation for AI acceleration modules that use PCIe x1/x2/x4
- 4 Higher quantity can be possible in customized Tensor-I22
OS Support
| Windows 10 |
| Windows 11 |
| Linux |
| Windows 10 IoT Enterprise LTSC 2021 / Windows 10 Pro |
| Windows 11 Pro |
| Linux Mint / Ubuntu |
Operating
conditions
Power
| Input power |
| Standard power input |
| Wide voltage power input |
| Modular power |
| 12V, 5.5 mm power jack w/ locking, 60W universal PSU |
| 12-56V, 6-pin ATX power connector w/ locking, 120W universal PSU |
Temperature
& humidity
| Commercial temperature |
| Extended temperature |
| Industrial temperature |
| Humidity |
| 0°C to 45°C |
| -20°C to 70°C |
| -40°C to 70°C |
| 5% – 95% non-condensing |
Mechanical
specifications
Dimensions
& weight
Standard housing
200 mm X 200 mm X 35.3 mm
Weight
420 gram
Housing
& cooling
All metal housing
Aluminium | zinc die cast parts
Fanless convection cooling through the housing
No vents
Mounting
Side/bottom VESA / DIN Rail mount 1
1 Sold separately
Additional
features
& services
Functional
features
- Auto-on
- Removable RTC battery
- Auxiliary power header
- RTC reset tactile switch
- Trusted Platform Module (TPM)
- Remote power button
Firmware & BIOS
features
- PXE boot
- Wake-on-LAN
- Wake-on-timer
Services
- OEM rebranding incl. logo and BIOS splash-screen
- Software imaging
- Burn-in testing