Tensor-I22
specifications

CPU

4 Core, 8 Threads | Base: 1.8/2.8 GHz, Boost: 4.4 GHz | 12 MB Cache | TDP: 15/28 W1 | vPro
4 Core, 8 Threads | Base: 1.5/2.6 GHz, Boost: 4.1 GHz | 8 MB Cache | TDP: 15/28 W1 | vPro
2 Cores, 2 Threads | Base: 1.8 GHz | 4 MB Cache | TDP 15 W

CPU frequency is preset to match cooling capacity and target case temperature.
Owner can adjust this setting in BIOS.
1 For 28W CPU operation, EW30-ECR20 housing is recommended (300 X 200 X 45.3 mm)

RAM

Up to 64 GB

2x SODIMM DDR4 up to 3200MT/S

Storage

Storage devices:
Basic configuration:
Optional TEL-NVME on TRIP1
Optional TEL-NVME on TRIP2
Optional TEL-SATA1 1
Up to 3 NVMe/ SATA storage devices
NVMe or SATA on M.2 (PCIe x4 Gen. 4 or SATA 3)
Additional NVMe on M.2 (PCIe x4 Gen. 3)
Additional SATA on M.2
Additional SATA on 2.5” for SSD/HDD

1 Some expansion TELs require a larger housing

Display

Graphics:
Display outputs:
HDMI
Mini-Display Port
Integrated Intel® Iris® Xe Graphics
Up to four independent displays
2x HDMI 1.4b (up to 3840 x 2160 @ 30Hz)
2x DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode

Networking

Ethernet ports
Basic configuration
Optional TEL-LANX2
Optional TEL-OPLNX2
Optional TEL-POEX2 1
Up to 4 ports
2x Gigabit Ethernet on RJ45
Additional 2x Gigabit Ethernet on RJ45
Additional 2x SFP+ ports for optical LAN
Additional 2x GbE LAN on RJ45 with PoE source of up to 15W each

1 Some expansion TELs require a larger housing

Wireless Connectivity
M.2 Key-E 1
M.2 Key-B 1
Optional TEL-PCIEmini
 
For M.2 2230 module with Wi-Fi 6E, BT 5.2
For M.2 LTE/5G
For mini PCIe module, w/ micro-SIM tray

1 Additional options are available with extension TELs

I/O

USB ports
Basic configuration
Optional TEL-USB3V4
Optional TEL- USB2V4

 

Up to 12 USB 3.1 / 2.0 ports
4x USB Type-A: 2x USB 3.1 + 2x USB 2.0
Up to 2 additional 4x USB 3.1 on USB Type-A
Up to 2 additional 4x USB 2.0 on USB Type-A
Audio
Codec
Interfaces
 
Optional analog audio on TEL-AUDIO
Optional analog output, analog input on 3.5 mm jacks
Serial/GPIO
Serial/GPIO ports 1
RS-232 / RS-485 1
CAN bus
GPIO
 
Up to 20 RS-232 / RS-485 or 40+ isolated GPIOs
Up to 20 RS-232 / RS-485 ports on DB9
Up to 5 isolated CAN bus ports on DB9
Up to 5 modules with 20 isolated GPIOs each, on terminal blocks

1 Some expansion TELs require a larger housing

Extensions

TEL
FT.C-LAN2
FT.EC-USB2V4
FT.ED-USB3PCIV4
FT.F-M2NVME for NVMe
FT.F-M2NVME for SATA
FT.F-M2NVME for AI
FT.H-SER4
FT.HB-DB9
FT.HA-SER1
FT.I-M2B
FT.J-M2E
FT.L-PCIEmini
FT.Q-CAN
FT.S-GPIO
FT.V-TERM4
FT.T-SATA1 2
FT.U-POE2
FT.W-OPLN2
Description Max. quantity Where connected PN
Additional 2x Gbit LAN 1 1 TRIP1 FC
Additional 4x USB 2.0 1 2 TRIP1 / TRIP2 FEC
Additional 4x USB 3.0 1 2 TRIP 1,2 FED
Additional M.2 Key-M for NVMe 1 1 TRIP1 FFN
Additional M.2 Key-M for SATA 1 1 TRIP2 FFS
Additional M.2 Key-M for AI module 3 1 TRIP2 FFS
1-4 isolated RS232 or RS485 3 TRIP1 / TRIP2 / int. USB FH
DB9 connector for FT.H-SER4 3 per FT.H-SER4 FT.H-SER4  
1 port RS232 3 TRIP1 / TRIP2 / int. USB FHA
Additional M.2 Key-B for modem 1 2 TRIP1 / TRIP2 FI
Additional M.2 Key-E for Wi-Fi/BT 1 2 TRIP1 / TRIP2 FJ
Mini PCIe compartment 2 TRIP1 / TRIP2 FL
Isolated CAN bus port 3 TRIP1 / TRIP2 / int. USB FQ
4 – 20 isolated GPIOs 3 TRIP1 / TRIP2 / int. USB FS
Terminal block 4x for FT.S-GPIO 4 per FT.S-GPIO FT.S-GPIO FV
2x Gbit Ethernet with PoE PSE 802.3at Type 1 by RJ45 1 TRIP1 FU
2 x SFP+ socket for optical GbE 1 TRIP1 FW
       

Notes:

  1. This interface is also available in some quantity on the motherboard, without a TEL expansion module.
  2. 2 FT.T-SATA1 requires larger hosing: EH35C or EW30
  3. 3 FT.F-M2NVME for AI includes enhanced heat dissipation for AI acceleration modules that use PCIe x1/x2/x4

OS Support

Windows 10
Windows 11
Linux
Windows 10 IoT Enterprise LTSC 2021 / Windows 10 Pro
Windows 11 Pro
Linux Mint / Ubuntu

Operating
conditions

Power

Input power
Standard power input
Wide voltage power input
Modular power
12V, 5.5 mm power jack w/ locking, 60W universal PSU
12-56V, 6-pin ATX power connector w/ locking, 120W universal PSU

Temperature
& humidity

Commercial temperature
Extended temperature
Industrial temperature
Humidity
0°C to 45°C
-20°C to 70°C
-40°C to 70°C
5% – 95% non-condensing

Mechanical
specifications

Dimensions
& weight

Standard housing
200 mm X 200 mm X 35.3 mm

Weight
420 gram

Housing
& cooling

All metal housing
Aluminium | zinc die cast parts

Fanless convection cooling through the housing
No vents

Mounting

Side/bottom VESA / DIN Rail mount 1

Sold separately

Additional
features
& services

Functional
features

  • Auto-on
  • Removable RTC battery
  • Auxiliary power header
  • RTC reset tactile switch
  • Trusted Platform Module (TPM)
  • Remote power button

Firmware & BIOS
features

  • PXE boot
  • Wake-on-LAN
  • Wake-on-timer 

Services

  • OEM rebranding incl. logo and BIOS splash-screen
  • Software imaging
  • Burn-in testing
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