Tensor-PC I20A
specifications
Figures
Base configuration
CPU
6 Cores, 12 Threads, 12 MB cache, ECC support
6 Cores, 12 Threads, 9 MB cache
4 Cores, 8 Threads, 8 MB cache
4 Cores, 4 Threads, 6 MB cache, ECC support
2 Cores, 2 Threads, 2 MB cache, ECC support
Note:
CPU frequency is preset to match cooling capacity and target case temperature.
Owner can adjust this setting in BIOS.
Chipset
RAM
Up to 64 GB DDR4-2400 ECC | non-ECC
2x SODIMM DDR4-2400 ECC | Non-ECC (unbuffered)
Graphics &
display
Integrated Intel UHD Graphics P630 / 630 / 610
Up to 3x DisplayPort 1.2 – 4K @ 60 Hz | HDMI 1.4 – 4K @ 30 Hz
Specific types of ports depends on selected TELs.
Native
I/O buses
and interfaces
Up to 38 PCIe 3.0 lanes (25 ports)
Up to 5x USB 3.1 gen 2
Up to 8x SATA 3
Notes:
- SATA ports are multiplexed with PCIe
- Some USB 3.1 ports are multiplexed with PCIe
- USB 3.1 gen 2 functionality depends on compatible TELs. Some TELs support only USB 3.1 gen 1
Functional features
Storage
features
NVMe M.2 2280
Up to 8 NVMe devices can be installed, each with PCIe 3 x4 interface
SATA M.2
Up to 2 SATA devices can be installed, (M.2 key-M 2280 | 2260 | 2242)
mSATA
Up to 2 mSATA devices can be installed
SATA 2.5"
Up to 2 2.5" SSD / HDD device can be installed
I/O
features
Display
Up to 3x 4K displays - DisplayPort 1.2 4096x2304 @ 60Hz - HDMI 1.4 4096x2160 @ 30Hz
USB
Up to 4x USB 3.1 gen 1 Over 40 ports of USB 2 can be installed USB power in S5 can be configured per port
Audio
3.5mm jacks. Headphones out + mic. in using TI PCM2912A Codec. Multiple audio ports can be installed.
Serial ports
Using DB9 connector. Each port supports RS232, RS485 half/full duplex and can be configured independently. Over 20 ports can be installed.
CANbus
Using DB9 connector Supports CAN 2.0A Specifications and ISO 11898-2 Bit rate of up to 1Mbit/s DIP switch for enabling/disabling on-board 120 Ohm termination Isolation per UL 1577, transient immunity: 30kV/uS, isolated DC 5V power CANbus is driven by a dedicated 32bit microcontroller (ARM Cortex M0 - STM32F042C6) running open source firmware that can be upgraded Driverless operation in Windows USB native device in Linux Over 10 ports can be installed
GPIOs
Unidirectional Isolation block, isolation per UL 1577 GPIOs are driven by a dedicated 32bit microcontroller (ARM Cortex M0 - STM32F072CB) running open source firmware that can be upgraded Each GPIO can be configured as input/output in software Terminal block connector 3.3V / 5V level can be selected by a DIP switch Over 100 GPIO ports can be installed
Networking
features
Gbit Ethernet
Using Intel i210, each port is on an independent PCIe port. Using RJ45 ports. 20 ports can be installed.
Gbit Ethernet with PoE source (PSE)
POE+ 802.3at 30W per port. Using Intel i210, each port is on an independent PCIe port. Using RJ45 ports. 12 ports can be installed
LTE
Universal LTE cat 6 by default. Other M.2 key-B or mini-PCIe modems can be installed. Each modem-TEL has a SIM card tray optionally accessible from the outside. Number of antennas as required by modems can be installed. Antennas can be positioned anywhere on the computer's perimeter. Up to 9 LTE modems can be installed.
Wi-Fi
Wi-Fi 6 (Intel AX200) by default. Buyer can install another Wi-Fi adapter. Number of Wi-Fi antennas as required by Wi-Fi module. Antennas can be positioned anywhere on the computer's perimeter. Up to 9 Wi-Fi adapters can be installed.
Bluetooth
Bluetooth 5.1 (Intel AX200) by default. Bluetooth is normally an added feature in a Wi-Fi adapter. Buyer can install another adapter. Up to 9 adapters can be installed.
Extension
features
M.2 key E
Up to 9 M.2 key-E devices can be installed
M.2 key B
Up to 9 M.2 key-B devices can be installed. Each has a SIM card tray optionally accessible from the outside.
M.2 key M
M.2 key-M devices up to M.2 2280 devices, PCIe x4 Each device has Integrated cooling Up to 8 M.2 key-M devices can be installed
Mini PCI Express
Up to 9 mini PCI express devices can be installed. Each has a SIM card tray optionally accessible from the outside.
PCI Express
-- under development --
Security, reliability
& manageability
features
Optional Trusted Platform Module 2.0 (TPM 2.0)
Infineon SLM 9670AQ2.0
Features: TPM 2.0, RSA-2048, ECC-256, SHA-256, EAL4+
Auto-detection of connected TELs and auto re-configuration
- TELs are identified during power-up
- TRIP mode is adjusted to comply with specific TEL requirements (e.g. 4x PCIe x1 / 1x PCIe x4 / SATA / USB3)
- If TEL is incompatible to TRIP capabilities, TEL is automatically disabled
Configuration control and reporting
- In BIOS, TRIPs and connected TELs can be listed
- For each TEL, revision, serial number and specific information (e.g. MAC address) can be displayed
- TEL connected to each TRIP can be enabled on detection, disabled, or unconditionally enabled
Configurable CPU TDP
Maximum power of the CPU can be adjusted in BIOS to match:
- Environmental conditions
- Cooling capacity of the enclosure
- Target operating temperature
Auto-on
On power resume, system powers on and boots.
BIOS & OS
BIOS
AMI Aptio V
Operating systems:
Windows 10 Professional | Linux Mint
Compatible with other Windows 10 variants.
Compatible with other Linux variants.
Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)
Tensor elements
(TELs)
Storage
TELs
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | TEL-NVME | M.2 2280 NVMe card or M.2 SATA | ||
 | TEL-MSATA | mSATA card | ||
 | TEL-SATAX1 | 2x 2.5" SSD / HDD |
Power
Modules
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | PM-12V | A miniature 12V power module with polarity, overvoltage protection and twist-lock jack | ||
 | PM-WIDE | A regulating wide-input voltage, high current power | ||
 | PM-BALANCER | A power load-balancer between two inputs for power |
I/O
TELs
Display TELs
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | TEL-HDMIMINIDP | HDMI + mini Display Port, designed for TRIP-M | ||
 | TEL-DPHDMI | Display Port + HDMI, designed for TRIP-M | ||
 | TEL-STD | Display Port + Gbit Ethernet on a single compact TEL, designed for TRIP-S |
USB TELs
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | TEL-USB3X4V | 4x USB3 type A vertical connectors, designed for TRIP-U | ||
 | TEL-USB3PCIV4 | 4x USB 3.1 type A vertical connectors, designed for TRIP 2,3,4,5,6. Note: USB 3.1 signals are converted from PCIe x1 using VL805 Host Controller. | ||
 | TEL-USB2X4V | 4x USB2 type A vertical connectors |
Other I/O TELs
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | TEL-AUDIO | Headphones / line-out + microphone using 2x 3.5mm | ||
 | TEL-SERX4 | 4x RS232 / RS485 with DB9 connectors | ||
 | TEL-CANBUS | CANbus interface using DB9 connector | ||
 | TEL-GPIO | Up to 20 isolated general purpose I/Os using terminal |
Networking
TELs
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | TEL-LANX2 | 2x Gbit Ethernet ports using RJ45 connectors | ||
 | TEL-LANX4 | 4x Gbit Ethernet ports using RJ45 connectors | ||
 | TEL-POEX2 | 2x Gbit Ethernet with PSE PoE (802.3at Type 1, 13W per port) using RJ45 connectors | ||
 | TEL-OPLNX2 | 2x fiber optics Gbit Ethernet using SFP+ sockets |
Extension
TELs
| Name | Description | Max units | Stacking | |
|---|---|---|---|---|
 | TEL-M2E | M.2 key-E socket | ||
 | TEL-M2B | M.2 key-B socket with a panel mounted tray for SIM card | ||
 | TEL-MINIPCIE | mini-PCIe socket with a panel mounted tray for SIM card |
Mechanical
specifications
Enclosure
variants
Tensor-PC I20A is offered in 18 different enclosure variants –
- 2 widths
- 3 compartment heights
- 3 types of cooling ribs
Width
- 20 cm (option W20)
- 30 cm (option W30)
Compartment height
- 2.5 cm – stacking A (option H25A)
- 3.5 cm – stacking C (option H35C)
- 4.9 cm – stacking A+C (option H49AC)
Cooling ribs
- Flat with no ribs (option C0)
- 1 cm ribs (option CR10)
- 2 cm ribs (option CR20)
Dimensions
& weight
Dimensions
From: 20 cm (W) x 20 cm (D) x 2.5 cm (H) – 1.0 liter
To: 30 cm (W) x 20 cm (D) x 6.9 cm (H) – 4.1 liter
Weight
From: 1 Kg to 4 Kg
- Dimensions depend on enclosure variant
- Weight depends on enclosure variant and on configuration
Housing
& cooling
All aluminum housing
Fanless cooling
Mounting
VESA mounting bracket*
Wall mounting bracket*
DIN-rail mounting bracket*
* Sold separately
Operating
conditions
Power
Input voltage range
12V – 56V*
Power consumption
20W – 60W
Power consumption depends on
– CPU type and TDP settings
– System load
– Installed devices
– Connected peripherals
* Input voltage range depends on the power module used.
Temperature
& humidity
Operating temperature range
Up to -40°C to 85°C*
Relative humidity
5% – 95% non-condensing
* When ordered in industrial temperature range. Commercial and extended temperature range are also available.