4 Core | Base: 2.0 GHz, Boost: 3.0 GHz | TDP: 12 W
4 Core | Base: 1.8 GHz, Boost: 3.0 GHz | TDP: 10 W
2 Core | Base: 1.3 GHz, Boost: 3.0 GHz | TDP: 6 W

Other pin-compatible CPUs are available for large volume orders.


Up to 32 GB

1x SO-DIMM DDR4 Non-ECC DDR4-3200MT/S (1.2V)


M.2 Key-M 2242 | 2260  | 2280
M.2 Key-B 2242 | 2260 
2.5″ SATA HDD/SSD Expansion 

NVMe or SATA M.2
Optional 2.5″ storage using SATA expansion (in development)


mini DP 1.2 
HDMI 1.4b 

DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode
HDMI 1.4b (up to 3840 x 2160 @ 30Hz)


Up to 4x Gbit Ethernet

2x Gigabit on-board Ethernet ports on RJ45 (1000 Mbps / 100 Mbps / 10 Mbps)
Additional 2x GbE LAN on RJ45 on FC3-LAN FACET Card (Optional)
Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN FACET Card (Optional)
Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED FACET Card (Optional)

On-board Wireless LAN
M.2 Key-E

Optional On-board module with Wi-Fi 6E, BT 5.2
For M.2 2230 module with Wi-Fi 6E, BT 5.2

M.2 Key-B for Cellular communication

Optional M.2, LTE/5G modem, with micro-SIM tray


6 on-board ports

4x USB 2.0 on USB Type-A
2x USB 3.1 on USB Type-A



Optional analog output, analog input on 3.5 mm jacks
Audio on display output via HDMI and DP


Optional isolated serial port (RS-232/422/485) and GPIO, up to 24V, on terminal block
2x isolated GPI + 2x isolated GPO


Function and Connectivity Extension T-Card (FACET card) interface
Available FACET cards:

  • FC3-LAN – 2x GbE LAN on RJ45
  • FC3-POED – GbE LAN PoE device on RJ45
  • FC3-OPLN – GbE on SFP+ for optic LAN
  • EB-M2SATA – SATA expansion for 2.5” HDD / SSD

FACET Card interface includes 2x PCIe, USB and I2C.
Additional FACET cards are under development.
FACET expansion card and Wi-Fi/BT card are mutually exclusive. For Wi-Fi/BT on systems with FACET cards, an onboard Wi-Fi/BT module must be selected.

1 Up to 1 unit of EB-M2SATA is possible, and up to two storage devices in total.
2 EB-M2SATA expansion requires deep bottom that will enlarge the fitlet3 size.


BIOS:  AMI Aptio V

Operating systems:
Windows 10 IoT Enterprise LTSC 2021
Windows 10 Pro
Windows 11 Pro
Linux Mint/ Ubuntu

Compatible with other Windows 10 /11 variants.

Compatible with other Linux variants.

Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)



Input voltage range
DC 9V – 42V

Power consumption
5W – 25W

Power consumption depends on
– CPU type
– System load
– Installed devices
– Connected peripherals


fitlet3 is low power Class III (EN/IEC 62368-1 Audio/video, information and communication technology) equipment that is to be powered from external DC Low Power  (LPS) unregulated power supply. The external power supply ratings and unregulated voltage boundaries should comply with ones defined in specifications of the specific model. Nominal current rating (A) should be increased if external peripheral devices are to be powered by fitlet3. Compulab delivers fitlet3 with a general purpose 12V 3A  AC-DC power adapter that isn’t an integral part of fitlet3 and may be ordered separately as an accessory. In case fitlet3 is powered from another power supply, user should ensure that power supply complies with fitlet3 power requirements. The power connector should meet the following requirements: a. 5.5 x 2.5mm standard barrel, b. Inner contact – fork type, c.“+” inner contact, “-” outer contact

& humidity

Operating temperature range
Up to -40°C to 85°C*

Relative humidity
5% – 95% non-condensing

* When ordered in industrial temperature range. Commercial and extended temperature range are also available. The power supply that ships with fitlet3 is not rated for extended temperatures. Buyer is advised to deploy fitlet3 in extended temperature with a suitable power supply.

Shock and vibration

MIL STD 810G compliant

  • Vibration test:
    IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz , 3 axis)
  • Shock test:
    IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g , 6 directions)


& weight

Standard housing
132.8 mm X 100 mm X 34.8 mm

420 gram

& cooling

All metal housing
Aluminium | zinc die cast parts

Fanless convection cooling through the housing
No vents


VESA / wall mounting bracket*
DIN-rail mounting bracket*

* Sold separately

& services


  • Auto-on
  • Programmable indicator LEDs
  • Removable RTC battery
  • Auxiliary power header
  • RTC reset tactile switch
  • Trusted Platform Module (TPM)
  • Remote power button

Firmware & BIOS

  • PXE boot
  • Wake-on-LAN
  • Wake-on-timer 


  • Kensington lock
  • Power plug twist lock
  • Mechanical disabling of power button


  • OEM rebranding incl. logo and BIOS splash-screen
  • Build-to-order
  • Software imaging
  • Burn-in testing
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