Tensor-PC I20A
specifications

Figures

Base configuration

CPU

6 Cores, 12 Threads, 12 MB cache, ECC support

6 Cores, 12 Threads, 9 MB cache

4 Cores, 8 Threads, 8 MB cache

4 Cores, 4 Threads, 6 MB cache, ECC support

2 Cores, 2 Threads, 2 MB cache, ECC support

Note:

CPU frequency is preset to match cooling capacity and target case temperature.
Owner can adjust this setting in BIOS.

RAM

Up to 64 GB DDR4-2400 ECC | non-ECC

2x SODIMM DDR4-2400 ECC | Non-ECC (unbuffered)

Graphics &
display

Integrated Intel UHD Graphics P630 / 630 / 610

Up to 3x DisplayPort 1.2 – 4K @ 60 Hz | HDMI 1.4 – 4K @ 30 Hz

Specific types of ports depends on selected TELs.

Native
I/O buses
and interfaces

Up to 38 PCIe 3.0 lanes (25 ports)

Up to 5x USB 3.1 gen 2

Up to 8x SATA 3

Notes:

  • SATA ports are multiplexed with PCIe
  • Some USB 3.1 ports are multiplexed with PCIe
  • USB 3.1 gen 2 functionality depends on compatible TELs. Some TELs support only USB 3.1 gen 1

Functional features

Storage
features

NVMe M.2 2280

Up to 8 NVMe devices can be installed, each with PCIe 3 x4 interface

SATA M.2

Up to 2 SATA devices can be installed, (M.2 key-M 2280 | 2260 | 2242)

mSATA

Up to 2 mSATA devices can be installed

SATA 2.5"

-- Under development --

I/O
features

Display

Up to 3x 4K displays
- DisplayPort 1.2 4096x2304 @ 60Hz
- HDMI 1.4 4096x2160 @ 30Hz

USB

Up to 4x USB 3.1 gen 1
Over 40 ports of USB 2 can be installed
USB power in S5 can be configured per port 

Audio

3.5mm jacks.
Headphones out + mic. in using TI PCM2912A Codec.
Multiple audio ports can be installed.

Serial ports

Using DB9 connector.
Each port supports RS232, RS485 half/full duplex and can be configured independently.
Over 20 ports can be installed.

CANbus

Using DB9 connector
Supports CAN 2.0A Specifications and ISO 11898-2
Bit rate of up to 1Mbit/s
DIP switch for enabling/disabling on-board 120 Ohm termination
Isolation per UL 1577, transient immunity: 30kV/uS, isolated DC 5V power
CANbus is driven by a dedicated 32bit microcontroller (ARM Cortex M0 -  STM32F042C6) running open source firmware that can be upgraded
Driverless operation in Windows
USB native device in Linux
Over 10 ports can be installed

GPIOs

Unidirectional Isolation block, isolation per UL 1577
GPIOs are driven by a dedicated 32bit microcontroller (ARM Cortex M0 - STM32F072CB) running open source firmware that can be upgraded
Each GPIO can be configured as input/output in software
Terminal block connector
3.3V / 5V level can be selected by a DIP switch
Over 100 GPIO ports can be installed

Networking
features

Gbit Ethernet

Using Intel i210, each port is on an independent PCIe port.
Using RJ45 ports.
20 ports can be installed.

Gbit Ethernet with PoE source (PSE)

POE+ 802.3at 30W per port.
Using Intel i210, each port is on an independent PCIe port.
Using RJ45 ports.
12 ports can be installed

LTE

Universal LTE cat 12 (SIMCOM SIM7912G-M2) by default.
Other M.2 key-B or mini-PCIe modems can be installed.
Each modem-TEL has a SIM card tray optionally accessible from the outside.
Number of antennas as required by modems can be installed. Antennas can be positioned anywhere on the computer's perimeter.
Up to 9 LTE modems can be installed.

Wi-Fi

Wi-Fi 6 (Intel AX200) by default.
Buyer can install another Wi-Fi adapter.
Number of Wi-Fi antennas as required by Wi-Fi module. Antennas can be positioned anywhere on the computer's perimeter.
Up to 9 Wi-Fi adapters can be installed.

Bluetooth

Bluetooth 5.1 (Intel AX200) by default.
Bluetooth is normally an added feature in a Wi-Fi adapter. Buyer can install another adapter.
Up to 9 adapters can be installed.

Extension
features

M.2 key E

Up to 9 M.2 key-E devices can be installed

M.2 key B

Up to 9 M.2 key-B devices can be installed.
Each has a SIM card tray optionally accessible from the outside.

M.2 key M

M.2 key-M devices up to M.2 2280 devices, PCIe x4
Each device has Integrated cooling
Up to 8 M.2 key-M devices can be installed

Mini PCI Express

Up to 9 mini PCI express devices can be installed. Each has a SIM card tray optionally accessible from the outside.

PCI Express

-- under development --

Security, reliability
& manageability
features

Optional Trusted Platform Module 2.0 (TPM 2.0)

Infineon SLM 9670AQ2.0

Features: TPM 2.0, RSA-2048, ECC-256, SHA-256, EAL4+

Auto-detection of connected TELs and auto re-configuration

  • TELs are identified during power-up
  • TRIP mode is adjusted to comply with specific TEL requirements (e.g. 4x PCIe x1 / 1x PCIe x4 / SATA / USB3)
  • If TEL is incompatible to TRIP capabilities, TEL is automatically disabled

Configuration control and reporting

  • In BIOS, TRIPs and connected TELs can be listed
  • For each TEL, revision, serial number and specific information (e.g. MAC address) can be displayed
  • TEL connected to each TRIP can be enabled on detection, disabled, or unconditionally enabled

Configurable CPU TDP

Maximum power of the CPU can be adjusted in BIOS to match:

  • Environmental conditions
  • Cooling capacity of the enclosure
  • Target operating temperature

Optional out-of-band management

Optional supervisor micro-controller featuring

  • Safe remote-BIOS-update
  • Powering up / powering down the system
  • Advanced watchdog
  • System recovery

Auto-on

On power resume, system powers on and boots.

BIOS & OS

BIOS
AMI Aptio V

Operating systems:
Windows 10 Professional | Linux Mint

Compatible with other Windows 10 variants.

Compatible with other Linux variants.

Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)

Tensor elements
(TELs)

Storage
TELs

Name Description Max units Stacking
TEL-NVMEM.2 2280 NVMe card or M.2 SATA
8
A,C
TEL-MSATAmSATA card
2
A,C
TEL-SATAX11x 2.5" SSD / HDD
8
A,C

Power
Modules

Name Description Max units Stacking
PM-12VA miniature 12V power module with polarity, overvoltage protection and twist-lock jack
2
A,C
PM-WIDEA regulating wide-input voltage, high current power
2
C
PM-BALANCERA power load-balancer between two inputs for power
1
A,C

I/O
TELs

Display TELs

Name Description Max units Stacking
TEL-HDMIMINIDPHDMI + mini Display Port, designed for TRIP-M
1
A,C
TEL-DPHDMIDisplay Port + HDMI, designed for TRIP-M
1
A,C
TEL-STDDisplay Port + Gbit Ethernet on a single compact TEL, designed for TRIP-S
1
A,C

USB TELs

Name Description Max units Stacking
TEL-USB3X4V4x USB3 type A vertical connectors, designed for TRIP-U
1
A,C
TEL-USB2X4V4x USB2 type A vertical connectors
12
A,C

Other I/O TELs

Name Description Max units Stacking
TEL-AUDIOHeadphones / line-out + microphone using 2x 3.5mm
10
A,C
TEL-SERX44x RS232 / RS485 with DB9 connectors
10
A,C
TEL-CANBUSCANbus interface using DB9 connector
10
A,C
TEL-GPIOUp to 20 isolated general purpose I/Os using terminal
10
A,C

Networking
TELs

Name Description Max units Stacking
TEL-LANX22x Gbit Ethernet ports using RJ45 connectors
6
A,C
TEL-LANX44x Gbit Ethernet ports using RJ45 connectors
5
A,C
TEL-POEX22x Gbit Ethernet with PSE PoE (POE+ 802.3at, 30W per port) using RJ45 connectors
6
C, A (W30)
TEL-OPLNX22x fiber optics Gbit Ethernet using SFP+ sockets
6
C, A (W30)

Extension
TELs

Name Description Max units Stacking
TEL-M2EM.2 key-E socket
9
A,C
TEL-M2BM.2 key-B socket with a panel mounted tray for SIM card
9
A,C
TEL-MINIPCIEmini-PCIe socket with a panel mounted tray for SIM card
9
A,C

Mechanical
specifications

Enclosure
variants

Tensor-PC I20A is offered in 18 different enclosure variants –

  • 2 widths
  • 3 compartment heights
  • 3 types of cooling ribs

Width

  • 20 cm (option W20)
  • 30 cm (option W30)

Compartment height

  • 2.5 cm – stacking A (option H25A)
  • 3.5 cm – stacking C (option H35C)
  • 4.9 cm – stacking A+C (option H49AC)

Cooling ribs

  • Flat with no ribs (option C0)
  • 1 cm ribs (option CR10)
  • 2 cm ribs (option CR20)

Dimensions
& weight

Dimensions

From: 20 cm (W) x 20 cm (D) x 2.5 cm (H) – 1.0 liter
To: 30 cm (W) x 20 cm (D) x 6.9 cm (H) – 4.1 liter

Weight

From: 1 Kg to 4 Kg

  • Dimensions depend on enclosure variant
  • Weight depends on enclosure variant and on configuration

Housing
& cooling

All aluminum housing

Fanless cooling

Mounting

VESA mounting bracket*

Wall mounting bracket*

DIN-rail mounting bracket*

* Sold separately

Operating
conditions

Power

Input voltage range
12V – 56V*

Power consumption
20W – 40W

Power consumption depends on
– CPU type and TDP settings
– System load
– Installed devices
– Connected peripherals

* Input voltage range depends on the power module used.

Temperature
& humidity

Operating temperature range
Up to -40°C to 70°C*

Relative humidity
5% – 95% non-condensing

* When ordered in industrial temperature range. Commercial and extended temperature range are also available.

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